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The Board Authority

Permanent Materials Issue
(09/2001)

Introduction by Dan Feinberg

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This issue of The Board Authority focuses on permanent materials and the processes that are used to make them part of the board. The original intent of this issue was to focus on materials rather than process. I have long felt that the ratio of permanent materials vs. consumables in a PWB should be as high as possible. This attains the highest value-added for the ultimate purchaser while at the same time maximizing margins for the fabricator. Keep this in mind: when a laminate is used, when a hole is metalized, when a solder mask or conformal coating is added to a PWB, that material stays with the board. These permanent materials continue to add value to the board for its full life cycle; they stay with it, becoming part of the final device. Consumable materials, those consumed during the manufacturing process, where an effect is seen in the finished product but the materials themselves are consumed and no longer remain as part of the device, certainly add value. In fact, most of these consumables are necessary. However, if an effect might be obtained without using up the consumable material, than a higher value ratio could be obtained.

I realize a modern day circuit board cannot be manufactured in reasonable volume without these consumable materials, at least at the present time. However, if an enterprising fabricator, supplier, or inventor succeeds in reducing the consumables used in PWB fabrication, they would enrich the industry as well as themselves. For example, imagine all the steps involved in pre-metalization cleaning, preparation, catalization, and so forth, were eliminated and you could still metalize the hole with no reduction in quality. The cost of making a board would be far lower and thus the final value-added would be higher.

I submit that the leading material suppliers in the future will be those that reduce, rather than increase, the number of steps needed to manufacture a PWB. The materials or processes that can do this will be worth more, and everyone will benefit. I will continue exploring this permanent-to-consumable ratio in the future, as I believe it has been over-looked and is far more important to the future of the industry than many realize today.

In this issue you will find a greater number of articles on emerging technologies and fewer on tried and true permanent materials. There are two reasons for this. Many of us believe that there is a process and material revolution on the horizon. Some of the materials and processes described here may be part of that revolution. In this regard, pay particular attention to the emerging technologies described by MCT and Dimensional Circuits, as well as materials described by Nelco, Rogers, and others.

The second reason is that some of the suppliers that had originally committed to provide articles were unable to do so. The reasons given were that the products they wanted to discuss were not as far along as they had hoped at this stage and/or the present state of the industry had necessitated a change in focus and thus they were not able to contribute at this time. I would especially like to thank Mike Carano of Electrochemicals for providing a needed article on hole plugging—and for doing it with only a few days notice.

Lastly, I wish to thank all of the authors. The quality of the articles and associated graphics in The Board Authority continues to set new standards. I realize that these are difficult times; those that took the time to research, prepare, and submit a completely original article for this issue at this stressful time deserve special recognition, appreciation, and kudos. I also want to thank The Board Authority staff for putting up with all my e-mails, late submissions, and opinionated comments. Now that we've gone to press, I will admit it has been an enjoyable and gratifying experience.

DAN FEINBERG

Permanent Materials
Table of Contents

8

Advanced Dielectric Materials for Chip Package Substrates
by MICHAEL D. COLL & STEVEN J. VACCARO
A new class of organic dielectric materials exists to satisfy the evolving demands on substrate performance, while still utilizing standard printed circuit board (PCB) processing methods and equipment.

14 Hole Plugging Technology for High Density Circuitry and Conventional Through Hole Multilayer PWBs
by MICHAEL CARONO
Via hole filling and plugging is both critical and permanent when it comes to PWB fabrication. This article addresses the need for filling plated through holes, blind vias, and buried vias, while reviewing the technology of via plugging/filling, methods of application, and the advantages and disadvantages of the process.
20 Fiber Glass Reinforcements within Circuit Board Composites
by DOUG ENG
An overview of the manufacturing and functions of fiber glass reinforcement within circuit board composites, and a look at future challenges and opportunities for fiber glass reinforcements.
26 New Thin-Film Technology: Low-k Dielectics Mean Less is More
by GIRISH DESHPANDE and STEIN LEE
A discussion of a new thin-film technology which can enable a reduction in the space between conducting pathways in integrated circuits.
30 Virtual Plating: Emerging Technology Unravels the Mysteries of Electrodeposition
by ROGER W. MOUTON
This article examines the emerging technology for accurate and consistent electroplating of complex multilayer and HDI substrates.
34 Metalization in Today's Competitive Environment
by ALFIO COLNAGO, DR. JURGEN HUPE, and KATHLEEN NARGI-TOTH
The implementation of direct metalization processes can provide cost reduction and quality enhancements.
44 Imprint Patterning: A Different and Possibly Disruptive HDI Option
by GEORGE GREGOIRE
Can the same basic process used for manufacturing CDs and DVDs revolutionize and simplify the PWB manufacturing process?
46 Selecting a Non-VOC Printed Circuit Board Coating
by JOE KOCH
A comparison of the properties of three types of low VOC PCB coatings is described in this article. All three coatings offer a zero VOC coating alternative.
48 Multilayer Material Technology for Improved Signal Integrity in the Region Above 5 GHz
by LEENA GULIA, FRED E. HICKMAN III, and BOB FORCIER
A review of allylated polyphenylene ether (APPE) resin with a novel glass reinforcement to produce a new substrate materials technology. This material system improves signal integrity for digital broadband and RF/microwave applications, and the benefits become magnified above the 5 GHz threshold.
54 Covercoats: Compatibility, Ease of Use, and Success Can Be Your Choice
by DIANA WILLIAMS
Covercoats are not only multifunctional materials that stay with the circuitry, but may offer alternatives that can assist in making them—and their end products—perform in ways that are still unimagined.
58 History of the Surface Build-Up Technology
by LEO ROOS, PH.D.
A process history and patent data base.

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